Mfg Part Number: 9931-BDKZ | Alternate P/N: 9931BDKZ | NSN : 5962-01-293-0137 |
NIIN : 012930137 | CAGE Code : K0656 | Manufacturer: Bae Systems Operations Limited Dba Bae Systems Plc |
Item Name : Microcircuit Memory | FSC : 5962 Microcircuits Electronic |
Thank you for choosing Aircraft Parts Supplier for all your operational needs. You have reached our NSN RFQ Page which features our in-demand NSN 5962-01-293-0137 parts and components such as Microcircuit Memory manufactured by Bae Systems Operations Limited Dba Bae Systems Plc. Some of these items include part number 9931-BDKZ, and various others, all of which have been subjected to a number of quality assurance measures, tests, verifications, and assessments. At Aircraft Parts Supplier, we make it our priority to only source from top global manufacturers that we trust, assuaging the worry of not receiving quality items from us.
The part 9931-BDKZ with NSN 5962-01-293-0137 that we feature by the manufacturer Bae Systems Operations Limited Dba Bae Systems Plc are paired alongside CAGE Code K0656 is available and readt to ship. Aircraft Parts Supplier carries a variety of NSN products, allowing us to be the go-to supplier for countless businesses. If you are familiar with the NSN associated with the item you are in search of, we invite you to take advantage of it. Similarly, other information regarding the NSN items you wish to purchase is equally as helpful, so please provide such details in the provided RFQ form below. When you fill out a form, in return, you will be provided a competitive quote for your comparisons in just 15 minutes or less.
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-293-0137 Item Description: Microcircuit Memory | 5962 | 012930137 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | B | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
9931-Bdkz | 2 | 2 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
MEMORY | ADAQ | BODY LENGTH0 960 INCHES MAXIMUM |
MEMORY | ADAT | BODY WIDTH0 220 INCHES MINIMUM AND 0 310 INCHES MAXIMUM |
MEMORY | ADAU | BODY HEIGHT0 185 INCHES NOMINAL |
MEMORY | AEHX | MAXIMUM POWER DISSIPATION RATING794 0 MILLIWATTS |
MEMORY | AFGA | OPERATING TEMP RANGE-55 0 TO 125 0 DEG CELSIUS |
MEMORY | AFJQ | STORAGE TEMP RANGE-65 0 TO 150 0 DEG CELSIUS |
MEMORY | CBBL | FEATURES PROVIDEDSCHOTTKY AND PROGRAMMABLE AND BIPOLAR AND MONOLITHIC AND 3-STATE OUTPUT |
MEMORY | CQSJ | INCLOSURE MATERIALCERAMIC |
MEMORY | CQSZ | INCLOSURE CONFIGURATIONDUAL-IN-LINE |
MEMORY | CQWX | OUTPUT LOGIC FORMTRANSISTOR-TRANSISTOR LOGIC |
MEMORY | CQZP | INPUT CIRCUIT PATTERN12 INPUT |
MEMORY | CTFT | CASE OUTLINE SOURCE AND DESIGNATORD-6 MIL-M-38510 |
MEMORY | CWSG | TERMINAL SURFACE TREATMENTSOLDER |
MEMORY | CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC-0 5 VOLTS MINIMUM POWER SOURCE AND 7 0 VOLTS MAXIMUM POWER SOURCE |
MEMORY | CZEQ | TIME RATING PER CHACTERISTIC85 00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME LOW TO HIGH LEVEL OUTPUT AND 85 00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME HIGH TO LOW LEVEL OUTPUT |
MEMORY | CZER | MEMORY DEVICE TYPEPROM |
MEMORY | TEST | TEST DATA DOCUMENT96906-MIL-STD-883 STANDARD INCLUDES INDUSTRY OR ASSOCIATION STANDARDS INDIVIDUAL MANUFACTUREER STANDARDS ETC |
MEMORY | TTQY | TERMINAL TYPE AND QUANTITY18 PRINTED CIRCUIT |
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